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DDR-C300U8G32

Memory Module

> Uses featured DRAM chip to provide great performance and high- speed data transmission.
> Curved gold finger to ensure stable installation and signal transmission.
> Reliable quality and lifetime warranty.
> Highly compatible; supports mainstream platforms such as Intel and AMD; plug-and-play.


  • Specifications
  • Accessories
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  • Technical

    Product Model

    DHI-DDR-C300S4G26

    DHI-DDR-C300S8G26

    DHI-DDR-C300S16G26

    DHI-DDR-C300S32G26

    Capacity

    4 GB

    8 GB

    16 GB

    32 GB

    Type

    SODIMM

    Applicable Model

    DDR4 laptop

    Voltage

    1.2 V

    CAS Latency

    CL19

    Operating Frequency

    2666 MHz

    Number of Pins

    260

    Operating Temperature

    0 °C to +70 °C (+32 °F to 158 °F)

    Storage Temperature

    ­20 °C to +85 °C (-4 °F to +185 °F)

    Operating Humidity

    25%–85% (non-condensing)

    Warranty

    Lifetime

    Product Dimensions

    69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

    Packaging Dimensions

    165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

    Net Weight

    8.5 g (0.02 lb)

    Gross Weight

    36 g (0.08 lb)

    Reference Information

    Note: ①The thickness is calculated at the thickest point.
    1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
    2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
    3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.

    Technical Specification

    Technical

    Product Model

    DHI-DDR-C300S4G32

    DHI-DDR-C300S8G32

    DHI-DDR-C300S16G32

    DHI-DDR-C300S32G32

    Capacity

    4 GB

    8 GB

    16 GB

    32 GB

    Type

    SODIMM

    Applicable Model

    DDR4 laptop

    Voltage

    1.2 V

    CAS Latency

    CL22

    Operating Frequency

    3200 MHz

    Number of Pins

    260

    Operating Temperature

    0 °C to +70 °C (+32 °F to 158 °F)

    Storage Temperature

    ­20 °C to +85 °C (-4 °F to +185 °F)

    Operating Humidity

    25%–85% (non-condensing)

    Warranty

    Lifetime

    Product Dimensions

    69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

    Packaging Dimensions

    165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

    Net Weight

    8.5 g (0.02 lb)

    Gross Weight

    36 g (0.08 lb)

    Reference Information

    Note: ①The thickness is calculated at the thickest point.
    1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
    2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
    3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.

    Technical Specification

    Technical

    Product Model

    DHI-DDR-C300U4G26

    DHI-DDR-C300U8G26

    DHI-DDR-C300U16G26

    DHI-DDR-C300U32G26

    Capacity

    4 GB

    8 GB

    16 GB

    32 GB

    Type

    UDIMM

    Applicable Model

    DDR4 desktop

    Voltage

    1.2 V

    CAS Latency

    CL19

    Operating Frequency

    2666 MHz

    Number of Pins

    288

    Operating Temperature

    0 °C to +70 °C (+32 °F to 158 °F)

    Storage Temperature

    ­20 °C to +85 °C (-4 °F to +185 °F)

    Operating Humidity

    25%–85% (non-condensing)

    Warranty

    Lifetime

    Product Dimensions

    69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

    Packaging Dimensions

    165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

    Net Weight

    16 g (0.04 lb)

    Gross Weight

    44 g (0.10 lb)

    Reference Information

    Note: ①The thickness is calculated at the thickest point.
    1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
    2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
    3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.

    Technical Specification

    Technical

    Product Model

    DHI-DDR-C300U4G32

    DHI-DDR-C300U8G32

    DHI-DDR-C300U16G32

    DHI-DDR-C300U32G32

    Capacity

    4 GB

    8 GB

    16 GB

    32 GB

    Type

    UDIMM

    Applicable Model

    DDR4 desktop

    Voltage

    1.2 V

    CAS Latency

    CL22

    Operating Frequency

    3200 MHz

    Number of Pins

    288

    Operating Temperature

    0 °C to +70 °C (+32 °F to 158 °F)

    Storage Temperature

    ­20 °C to +85 °C (-4 °F to +185 °F)

    Operating Humidity

    25%–85% (non-condensing)

    Warranty

    Lifetime

    Product Dimensions

    69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①

    Packaging Dimensions

    165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")

    Net Weight

    16 g (0.04 lb)

    Gross Weight

    44 g (0.10 lb)

    Reference Information

    Note: ①The thickness is calculated at the thickest point.
    1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
    2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
    3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.